Labelexpo India to host on-site Brand Innovation Day

The Labelexpo India Brand Innovation Day is sponsored by HP, Avery Dennison and SMI.


The organizer of Labelexpo India is hosting an exclusive Brand Innovation Day on-site at Labelexpo India 2018, taking place at India Expo Center & Mart in Greater Noida, Delhi NCR, on 22 November. This is day one of the four-day show.


Aimed at up to 50 brand owners and packaging designers in India, the purpose of the day is to equip delegates with expert insight into making the most out of their brand, how they can overcome key challenges on the path to future growth, and staying ahead of the competition in a fast-paced industry as a result.


The day will include a short program of expert-led presentations, a hosted networking lunch, a panel discussion and Q&A, plus a short tour of key suppliers at the show. This will highlight the latest technologies and give practical examples showing how brands can achieve stand-out product presence. Delegates will also have the option to attend the prestigious LMAI awards, and network with peers and VIPs.


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Labelexpo Global Series managing director Lisa Milburn, who will open the Brand Innovation Day, said: “Our most commonly asked question at Labelexpo India is how brands can learn how to use their labels and packaging to stand out from the competition. Given the success and popularity of our educational program for our other Labelexpo events including our upcoming Americas show in late September, we wanted to provide similar opportunities for Labelexpo India attendees. The appetite for labels and package printing continues undiminished in India and it is now one of the biggest growth markets, so it felt the right moment to offer this educational opportunity to brand owners and packaging designers at the show itself.


“The Brand Innovation Day is a rare chance for them to gain industry insights into how a brand can be inspired to innovate, experience the highlights of Labelexpo India 2018, and learn the tricks of the trade from the experts.”


Schedule highlights include Andy Thomas-Emans, director of strategy for Labelexpo Global Series, who will chair a panel discussion on product decoration. Speakers include Chakravarthi AVPS, global ambassador for the World Packaging Organization, who will be speaking about global packaging trends and how to adapt to constantly changing consumer demands; Sukhdev Singh Saini, packaging lead AMEA, General Mills, who will speak about creating environmental awareness in the branding of a product including how to handle recycling of both raw materials and end use products; and Kanchan Bhargava, senior brand manager, Twinings, who will explore ways of leveraging packaging design and its role in brand building and increasing market share.


Chakravarthi AVPS said: “India is one of the world’s fastest emerging markets, which has created a fantastic opportunity for brands and packaging designers. We are seeing really exciting trends evolving in the region, which cater to millennials’ choices. We are working on possibilities of designs that address personalized marketing, sustainability, especially total recyclability. With the increasing legislation on the compliance front in domestic and international markets, the thrust on safe packaging is predominant as well.


“However, for the industry to remain competitive and fresh, brands can’t afford to be complacent, and need to be constantly updating their knowledge. Labelexpo India’s Brand Innovation Day is an unmissable opportunity for them to do this.”


Labelexpo India, the largest label and package printing event in South Asia, will run 22 to 25 November. With 250 industry-leading exhibitors, the sold-out show offers highly valuable networking opportunities for visitors and exhibitors alike, bringing together the entire supply chain with machinery, ancillaries, substrates and ink suppliers all under one roof.


There is no cost to attend the Brand Innovation Day and entry is free to Labelexpo India 2018. Places on the Brand Innovation Day are, however, extremely limited, and interested attendees should register by emailing Tina Mandla at as soon as possible. 

For full schedule details, visit



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For further information about the Labelexpo Global Series, please contact:

Helen Stoddart, Communications Manager, Labelexpo Global Series

Tel +44 (0)20 8846 2720 or email:


Notes to editors:


The Labelexpo India Brand Innovation Day is sponsored by HP, Avery Dennison and SMI.


In 2016, Labelexpo India welcomed 8,029 visitors, and with a show floor size of 5,899 sqm, was its largest to date. 200 exhibitors took part.


Labelexpo India 2018 is supported by the Label Manufacturers Association of India (LMAI), All India Federation of Master Printers (AIFMP), Delhi Printers Association (DPA) and Authentication Solution Providers’ Association. Labelexpo India 2018 is also supported by the Sri Lanka Association of Printers (SLAP), Printing Industries Association of Bangladesh (BMSS) and Federation of Nepal Printers Association (FNPA).


To keep up to date on the latest developments, follow Labelexpo on Twitter at @Labelexpo or visit

For more information about the Avery Dennison sponsored LMAI Awards evening (booking required), visit


About World Packaging Organisation (WPO):

The World Packaging Organisation is a non-profit, non-governmental, international federation of national packaging institutes and associations, regional packaging federations and other interested parties including corporations and trade associations.


For more information visit


To register for Labelexpo India visit

Press registration for Labelexpo India is now open. Visit